高导热双面铜基电路板

高导热双面铜基电路板
紫铜基材，板厚1.6mm,有散热过电孔，绝缘通孔非金属化，导热介质2.0W,介质层厚120um
白油黑字，表面沉金，铜厚35um

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高导热双面铜基电路板
紫铜基材，板厚1.6mm,有散热过电孔，绝缘通孔非金属化，导热介质2.0W,介质层厚120um
白油黑字，表面沉金，铜厚35um

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